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NexSymp: 3rd International Symposium on Information Technology and Web Engineering  (SITWE 2026)

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Sustainable Transformation through Artificial Intelligence

The 3rd International Symposium on Information Technology and Web Engineering (SITWE 2026) will be held  on 29th  -30th September 2026 in hybrid mode. This symposium is being co-organized by MMU Press Journal of Informatics and Web Engineering and Center for Digital Innovations, Multimedia University.

SITWE 2026 aims to bring together leading academic scientists, researchers and research scholars to exchange and share their experiences and research results on all aspects of Information Technology and Web Technology. It also provides a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns for the ICT domain.

Interested domains of the symposium include but are not limited to:

  • Artificial Intelligence & Machine Learning (Machine learning algorithms, Data mining and knowledge discovery, Neural networks and deep learning, Recommender systems, and Intelligent agents) 
  • Software and Web Engineering (Software development, Requirements engineering, Semantic web, Ontology engineering, and Usability engineering)
  • Information Systems and Applied Informatics (Databases, Information retrieval, Internet of Things (IoT), Mobile computing, Cloud computing, and Digital transformation applications) 
  • Emerging Digital Technologies (Big data, Blockchain, Visual analytics, and Visual computing interfaces for web and mobile platforms)
  • Cybersecurity, Privacy, and Trust (Network security, Cryptography, Data privacy, Authentication and access control, and Encryption methods)

Submission and Publication

Track 1: MMU Press Journals
(Registration fee: Free)
Track 2: Associated Journals (Scopus)
(Registration fee: USD60)
• Pathway to publication in MMU Press journal (JIWE) or Highlights in Web Engineering III (HIWE III book)
• Free (No APC)Submission link:
(select under section: NexSymp – SITWE2026)
• Publication via external partner Scopus journals.
• APC/Publication fees payable directly to the journal upon acceptances

 

 

Paper Submission Guidelines:

Paper Template:

Submission link:

Publication Notes

  1. All submissions are subject to peer review and editorial decision.
  2. Acceptance for presentation does not guarantee final journal publication as it is subject to authors completing all required revisions and editorial requirements.
  3. Final publication decisions rest with the respective journal editors.
  4. APC/Publication fees (if applicable) is separate from the registration fee and payable directly by the authors to the respective journal upon acceptance.
  5. Important: While Track 2 provides access to journals that are currently Scopus-indexed, Scopus indexing is not guaranteed by NexSymp Summit 2026 or MMU Press. Indexing status is determined solely by the respective journals and indexing bodies, and may change at any time. Authors are advised to verify a journal’s current indexing status independently before submission.
  6. Papers not selected for associated journals may be considered for NexSymp Summit Proceedings (eISBN) published by MMU Press, subject to editorial review and quality requirements.
Track 1 Track 2
Registration fee Free USD 60
APC/ Publication fees None May apply (payable to the journal)
Submission system Direct submission to MMU Press journals (OJS) CMT
Publication scope MMU Press journals External partner journals
Fallback if not published Not applicable NexSymp Summit  Proceedings (eISBN)

KEYNOTE SPEAKERS

Coming Soon

INVITED SPEAKERS

Coming Soon

Dates and Registration

Description

Deadline

Full paper submission deadline

1 June 2026

Paper acceptance notification

15 August 2026

Camera ready submission

24 August 2026

Registration deadline

24 August 2026
Conference date

29-30 September 2026

PAYMENT METHODS

Online Payment [link to Cynergy payment gateway]

If you are from a collaborator institution and are eligible for an additional discount, please contact your institution’s PIC or our team to obtain a discount coupon for online payment.

Bank Transfer

  • Account Name: Unitele Multimedia Sdn. Bhd.
  • Bank: CIMB Islamic Bank Berhad
  • Account No.: 86-0090180-2
  • SWIFT Code: CTBBMYKL

Note: Please include your paper ID and name as reference.

REGISTRATION FEES

Registration and presentation at NexSymp Summit 2026 are required for all accepted papers to proceed with publication consideration.

Fee Structure

Tracks

Registration Fees

(excl. APCs)

Track 1: MMU Press Journals Free
Track 2: Associated Journals (Scopus) USD 60

What the Registration Fee Covers

  • Conference participation
  • Presentation of accepted paper
  • Access to the selected submission tracks

Important Fee Notes

  • Registration fee covers symposium participation only.
  • APC/Publication fees (if applicable) is separate from the registration fee and payable directly by the authors to the respective journal upon acceptance.
  • Each accepted paper requires at least one registered author.
  • Non-registration or non-presentation may result in withdrawal from publication consideration.

Who Should Attend?

  • Undergraduate and postgraduate computer/IT students
  • Researchers

Chair:

Chair  – Dr. Goh Hui Ngo (Multimedia University, Malaysia)

Co-Chair  – Dr. Lee Fong Yee (Multimedia University, Malaysia)

Technical Chair – Prof. Ts. Dr. Heng Swee Huay (Multimedia University, Malaysia), Assoc. Prof. Ts. Dr. Pang Ying Han (Multimedia University, Malaysia), TBA

Publication Chair – Prof. Dr. Haw Su Cheng (Multimedia University, Malaysia), TBA

Publicity Chair – TBA

Collaboration Chair – Dr. Palanichamy Naveen (Multimedia University, Malaysia), TBA

Program Chair – Ts. Dr. Neo Han Foon (Multimedia University, Malaysia), TBA

 

Technical Program Committee:

  • Assistant Prof. Dr. Timothy Tzen Vun Yap (Heriot-Watt University Malaysia)
  • Assistant Prof. Dr. Rosalind Deena Kumari (Heriot-Watt University Malaysia)
  • Assistant Prof. Dr. Chong Chai Chua (Xiamen University Malaysia)
  • Assoc. Prof. Dr. Gan Keng Hoon (University Sains Malaysia, USM)
  • Assistant Prof. Dr. Amy Lim Hui Lan (Multimedia University)
  • Assoc. Prof. Dr. Ho Sin Ban (Multimedia University, Malaysia)
  • Dr. Elham Anaam (Multimedia University, Malaysia)
  • Dr. Jayapradha J. (SRM Institute of Science and Technology, India)
  • Prof. Dr. Logeswaran A/L N Rajasvaran (HELP University)
  • Prof. Dr. Sellappan Palaniappan (HELP Universtiy)
  • Dr. Yong Yoke Leng (HELP University)
  • Dr. Dana Sulistyo Kusumo (Telkom University, Indonesia)
  • Dr. Nungki Selviandro (Telkom University , Indonesia)
  • Dr. Heru Agos Santoso (Universitas Dian Nuswantoro, Indonesia)
  • Dr. Arfive Gandhi (Telkom University , Indonesia)
  • Dr. Xiaolei Wang (Aalto University, Finland)
  • Dr. George Ghinea (Brunel University, United Kingdom)
  • Dr. Umashankar Subramaniam (Prince Sultan University, Saudi Arabia)
  • Dr . Aritra Ghosh (University of Exeter, United Kingdom)
  • Dr.Kaushik Pal (Universidade Federal do Rio de Janeiro, Brazil)
  • Jyotir Moy Chatterjee (Asia Pacific University of Technology & Innovation, Nepal)
  • Dr. R.Manimegalai (PSG Institute of Technology and Applied Research. India)
  • Assistant Prof. Yogesh Kushwaha (Indrashil University, India)
  • Assistant Prof. Bhavini Patel (Indrashil University, India)
  • Assistant Prof. Riddhi Mehta (Indrashil University, India)
  • Assistant Prof. Bhargavi Panchal (Indrashil University, India)
  • Assistant Prof. Jaldeep Babaria (Indrashil University, India)
  • Assistant Prof. Kirit Vadhel (Indrashil University, India)
  • Assoc. Prof. Dr. S. Sekar (SRM Valliammai Engineering College, Chennai, India)
  • Assoc. Prof. Dr. D. Sridevi (SRM Valliammai Engineering College, Chennai, India)
  • Assistant Prof. Dr. S. Sandhya (SRM Valliammai Engineering College, Chennai, India)
  • Prof. Dr. A. Samydurai (SRM Valliammai Engineering College, Chennai, India)
  • Assoc. Prof. Dr. G. Kumaresan (SRM Valliammai Engineering College, Chennai, India)
  • Assistant Prof. Dr. G. Sangeetha (SRM Valliammai Engineering College, Chennai, India)

CMT Acknowledgement

The Microsoft CMT service was used for managing the peer-reviewing process for this conference. This service was provided for free by Microsoft and they bore all expenses, including costs for Azure cloud services as well as for software development and support.

Collaborators:

Technical Sponsor: